Groundspeed to Present at 2018 Plug and Play New York Summit

NEW YORK, NY, September 4, 2018 – Groundspeed is excited to announce that its leadership will be presenting at the 2018 Plug and Play Summit tomorrow, September 5, 2018.  The annual summit brings together the best entrepreneurs, partners, insurtech thought leaders, and VC’s in the financial services capital of the United States. This year’s event will be held at the Deutsche Bank in New York City.